A new approach to the high resolution electrodeposition of metals via the feedback mode of the scanning electrochemical microscope.

Citation:

Mandler D, Bard AJ. A new approach to the high resolution electrodeposition of metals via the feedback mode of the scanning electrochemical microscope. J. Electrochem. Soc.Journal of the Electrochemical Society. 1990;137 (4) :1079 - 86.

Date Published:

1990///

Abstract:

Au and Pd electrodeposition in polymer films immersed in soln. with high resoln. has been accomplished using the scanning electrochem. microscope (SECM). The SECM was used in the feedback mode, where Ru(NH3)63+ was reduced at an ultramicroelectrode (UME) and diffused to a protonated polyvinylpyridine-coated surface. When metal anions e.g., AuCl4- or PdCl42-, were incorporated in the polymeric matrix, the diffusion of reduced mediator, Ru(NH3)2+, from the UME to the polymer film resulted in metal deposition. The different factors that det. the size and pattern of deposited metal were examd. The difference between Au and Pd deposition was studied by several techniques and interpreted in terms of kinetic and thermodn. properties of the mediator and the metal complex. [on SciFinder(R)]

Notes:

CAPLUS AN 1990:225478(Journal)